Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10462272 | Electronic device including housing having at least one through hole | Min-Su Jung, Jae Wan Kim, Kwang-Tai Kim, Seung Ah OH, Jung Won Lee +1 more | 2019-10-29 |
| 10392457 | Method of preparing thermoplastic resin | Hyung Sub Lee, Min Cheol Ju, Min Seung Shin, In Soo Kim | 2019-08-27 |
| 10316109 | Thermoplastic resin and thermoplastic resin composition including the same | Hyung Sub Lee, Min Cheol Ju, Min Seung Shin, In Soo Kim | 2019-06-11 |