Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461778 | Interleaving and puncturing apparatus and method thereof | Hong-sil Jeong, Sang-Hyo Kim, Kyung-joong Kim, Se-ho Myung, Jong Hwan Kim +1 more | 2019-10-29 |
| 10414876 | Method for preparing superabsorbent resin comprising fine powder re-assembled body of superabsorbent resin, and superabsorbent resin prepared thereby | Young-Sam Kim | 2019-09-17 |
| 10229865 | Fan-out semiconductor package | Yong Jin SEOL, Chang Bae Lee | 2019-03-12 |
| 10221752 | Split cooling apparatus for internal combustion engine | Kwang Sik Yang, Jun Sik Park, Woo Yong Lee | 2019-03-05 |