Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510579 | Adhesive resin composition for semiconductor, adhesive film for semiconductor, and dicing die bonding film | Jung Hak Kim, Kwang Joo Lee | 2019-12-17 |
| 10338020 | Method for measuring metal ion permeability of polymer film and device for measuring metal ion permeability of polymer film | Jung Hak Kim, Young-Kook Kim, Kwang Joo Lee, Se Ra Kim, Jung Ho Jo +2 more | 2019-07-02 |
| 10324016 | Method for measuring metal ion permeability of polymer film and device for measuring metal ion permeability of polymer film | Young-Kook Kim, Jung Hak Kim, Se Ra Kim, Jung Ho Jo, Kwang Joo Lee +2 more | 2019-06-18 |
| 10253223 | Semiconductor device and method for manufacturing the same using an adhesive | Jung Hak Kim, Se Ra Kim, Kwang Joo Lee, Seung Hee Nam, Young-Kook Kim | 2019-04-09 |