Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312408 | Light emitting diode chip scale packaging structure and direct type backlight module | Che-Hsuan Huang, Hsin-Lun Su, Chih-Hao Lin, Tzong-Liang Tsai | 2019-06-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312408 | Light emitting diode chip scale packaging structure and direct type backlight module | Che-Hsuan Huang, Hsin-Lun Su, Chih-Hao Lin, Tzong-Liang Tsai | 2019-06-04 |