Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347530 | Method of forming interconnect structure with partial copper plating | Hai Li | 2019-07-09 |
| 10262891 | Substrate having two semiconductor materials on insulator | Hai Li | 2019-04-16 |
| 10199478 | Transistor and method for forming the same | Herb He Huang, Clifford Drowley, Hai Li | 2019-02-05 |