Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10233556 | Dynamic modulation of cross flow manifold during electroplating | Jacob L. Hiester, Lee Peng Chua, Bryan L. Buckalew | 2019-03-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10233556 | Dynamic modulation of cross flow manifold during electroplating | Jacob L. Hiester, Lee Peng Chua, Bryan L. Buckalew | 2019-03-19 |