Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410959 | Lead package and method for minimizing deflection in microelectronic packaging | Franklin Kim, Shinichi Hira | 2019-09-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410959 | Lead package and method for minimizing deflection in microelectronic packaging | Franklin Kim, Shinichi Hira | 2019-09-10 |