Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10370573 | Easily deformable aggregate and method for manufacturing same, thermally conductive resin composition, thermally conductive member and method for manufacturing same, and thermally conductive adhesive sheet | Kaori Sakaguchi, Taiki Sakamoto, Atsushi Nakazato, Takanori Itoh, Daisuke Kishi | 2019-08-06 |