Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468288 | Methods and systems for chucking a warped wafer | Aviv Balan, Savita Chandan, Chia-Chu Chen, Teck Meriam | 2019-11-05 |
| 10381256 | Apparatus and method for chucking warped wafers | Pradeep Subrahmanyan, Chris Pohlhammer | 2019-08-13 |