Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10455694 | Method for manufacturing a multi-layer circuit board capable of being applied with electrical testing | Chin-Kuan Liu, Chao-Lung Wang, Yu-Te Lu, Chin-Hsi Chang | 2019-10-22 |
| 10334719 | Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same | Chin-Kuan Liu, Chao-Lung Wang, Yu-Te Lu, Chin-Hsi Chang | 2019-06-25 |