Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10494547 | Additive composition and positive polishing slurry composition including the same | Jang Kuk KWON, Sung Pyo LEE, Jun Ha HWANG | 2019-12-03 |
| 10435587 | Polishing compositions and methods of manufacturing semiconductor devices using the same | Seung Ho Park, Ki Hwa Jung, Sang Kyun Kim, Jun Ha HWANG, Seung Yeop Baek +4 more | 2019-10-08 |
| 10421883 | Abrasive particle-dispersion layer composite and polishing slurry composition including the same | Jang Kuk KWON, Sung Pyo LEE, Jun Ha HWANG | 2019-09-24 |