MK

Michiya Kohiki

JM Jx Nippon Mining & Metals: 4 patents #1 of 61Top 2%
📍 Ibaraki, JP: #41 of 660 inventorsTop 7%
Overall (2019): #47,877 of 560,194Top 9%
4
Patents 2019

Issued Patents 2019

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
10349531 Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method Nobuaki Miyamoto 2019-07-09
10257938 Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board 2019-04-09
10187983 Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board Tomota Nagaura 2019-01-22
10178775 Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board Yoshiyuki Miyoshi, Masafumi Ishii 2019-01-08