Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10249552 | Semiconductor package having double-sided heat dissipation structure | Yun Hwa CHOI | 2019-04-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10249552 | Semiconductor package having double-sided heat dissipation structure | Yun Hwa CHOI | 2019-04-02 |