Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10488439 | Compressible layer with integrated bridge in IC testing apparatus | Wei Kuong FOONG, Kok Sing GOH, Eng Kiat LEE | 2019-11-26 |
| 10466300 | High precision vertical motion kelvin contact assembly | Wei Kuong FOONG, Kok Sing GOH, Eng Kiat LEE, Mei Chen CHIN | 2019-11-05 |
| 10446965 | Spring contact in a testing apparatus for integrated circuits | Wei Kuong FOONG, Kok Sing GOH, Eng Kiat LEE | 2019-10-15 |