Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10330539 | High precision high reliability and quick response thermosensitive chip and manufacturing method thereof | Wenting Chen, Jun Yang, Qixing Bai, Limin Tang, Jiankai Ye | 2019-06-25 |