Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10187999 | Method for manufacturing an ultra-thin metal layer printed circuit board | Futang Fang, Peng Chang | 2019-01-22 |
| 10182501 | Method for preparing adhesive-free polyimide flexible printed circuit board | Peng Chang, Gangqiang Cai | 2019-01-15 |