Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504875 | Die-bonding substrate, high-density integrated COB white light source and method for manufacturing the same | Jieqin Zhang, Maochun HONG, Wenxiong Lin, Wang Guo, Yunfeng Zhang | 2019-12-10 |