Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461004 | Integrated circuit substrate and method of producing thereof | Zalina Binti Abdullah, Roslan Bin Ahmad, Poh Cheng Ang, Hai San Tew, Shin Hung Hwang +2 more | 2019-10-29 |