Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424492 | Method of fabricating integrated circuit packaging with etched base | Loke Chew Low, Poh Cheng Ang | 2019-09-24 |
| 10190218 | Integrated circuit substrate containing photoimageable dielectric material and method of producing thereof | Loke Chew Low, Poh Cheng Ang | 2019-01-29 |