Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403557 | Bonding scheme for diamond components which has low thermal barrier resistance in high power density applications | Julian Anaya Calvo, Martin Hermann Hans Kuball, Daniel James Twitchen | 2019-09-03 |
| 10366936 | Electronic device component with an integral diamond heat spreader | — | 2019-07-30 |