Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388594 | Protection from ESD during the manufacturing process of semiconductor chips | Frederick Ray Gomez, Tito Mangaoang | 2019-08-20 |
| 10347569 | Leadframe package with stable extended leads | — | 2019-07-09 |
| 10204814 | Semiconductor package with individually molded leadframe and die coupled at solder balls | — | 2019-02-12 |