Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396746 | Method of forming an integrated resonator with a mass bias | Byron Neville Burgess, William R. Krenik | 2019-08-27 |
| 10233074 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2019-03-19 |