Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10488608 | Pluggable optical module with heat sink | Richard Hibbs, Warren Meggitt, Andreas Bechtolsheim, Jiayi Wu, Christophe Metivier | 2019-11-26 |
| 10424546 | Electromagnetic interference absorber ring | Duong Lu, Jiayi Wu, Richard Hibbs, Paul Miller | 2019-09-24 |
| 10424887 | Hybrid power delivery assembly | Jeffrey Hirschman, Matthew Gawlowski, Youngbae Park, Duong Lu, Alex Rose +1 more | 2019-09-24 |
| 10411423 | OSFP to OSFP module form factor adapter | Youngbae Park, Jiayi Wu, Warren Meggitt, Richard Hibbs | 2019-09-10 |
| 10211555 | Method and apparatus to mitigate assembly torsion | Duong Lu, Richard Hibbs, Ian Fry, Arul Ramalingam, Jim Weaver +1 more | 2019-02-19 |