Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461021 | Electronic assembly with enhanced thermal dissipation | Thomas J. Roan, Michael J. Zurn, Brad G. Palmer, Brij N. Singh | 2019-10-29 |
| 10356926 | Electronic assembly with enhanced high power density | Brij N. Singh, Thomas J. Roan, Michael J. Zurn, Brad G. Palmer, Jeff Hansen | 2019-07-16 |