Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347615 | Method of fabricating an optical module that includes an electronic package | Jay Lee, Jong-Min Hong | 2019-07-09 |
| 10242976 | In-package photonics integration and assembly architecture | — | 2019-03-26 |