Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483237 | Vertically stacked multichip modules | Changyoung Park | 2019-11-19 |
| 10403601 | Semiconductor package and related methods | Seungwon IM, Oseob Jeon, Joonseo SON, Olaf Zschieschang | 2019-09-03 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483237 | Vertically stacked multichip modules | Changyoung Park | 2019-11-19 |
| 10403601 | Semiconductor package and related methods | Seungwon IM, Oseob Jeon, Joonseo SON, Olaf Zschieschang | 2019-09-03 |