LS

Lei Shan

UN Unknown: 1 patents #394 of 3,590Top 15%
IBM: 1 patents #5,496 of 11,143Top 50%
📍 Carmel, NY: #11 of 30 inventorsTop 40%
🗺 New York: #2,767 of 13,137 inventorsTop 25%
Overall (2019): #147,256 of 560,194Top 30%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10190031 Thermally conductive interface composition and use thereof Jiali Wu, Kellsie Shan 2019-01-29
10170249 Multi-layer capacitor package — 2019-01-01