Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10498292 | Amplifiers and amplifier modules having stub circuits | Enver Krvavac, Yu-Ting David Wu, Nick Yang | 2019-12-03 |
| 10381984 | Amplifiers and amplifier modules with shunt inductance circuits that include high-Q capacitors | Yu-Ting David Wu, Enver Krvavac, Nick Yang, Damon G. Holmes, Shishir Ramasare Shukla +3 more | 2019-08-13 |
| 10284146 | Amplifier die with elongated side pads, and amplifier modules that incorporate such amplifier die | Yu-Ting David Wu, Nick Yang | 2019-05-07 |
| 10284147 | Doherty amplifiers and amplifier modules with shunt inductance circuits that affect transmission line length between carrier and peaking amplifier outputs | Yu-Ting David Wu, Enver Krvavac | 2019-05-07 |
| 10263067 | Chip capacitor circuit and structure therefor | Yu-Ting David Wu, Shishir Ramasare Shukla, Enver Krvavac, Hussain H. Ladhani, Damon G. Holmes | 2019-04-16 |
| 10250197 | Multiple-stage power amplifiers implemented with multiple semiconductor technologies | Enver Krvavac, Yu-Ting David Wu, Nick Yang, Jeffrey K. Jones, Mario M. Bokatius +1 more | 2019-04-02 |
| 10236852 | Parallel LC resonator and method therefor | Hussain H. Ladhani, Enver Krvavac, Yu-Ting David Wu | 2019-03-19 |