Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504806 | Semiconductor package with electrical test pads | — | 2019-12-10 |
| 10497655 | Methods, circuits and systems for a package structure having wireless lateral connections | Alberto Pagani | 2019-12-03 |
| 10483238 | Ink printed wire bonding | — | 2019-11-19 |
| 10468344 | Method of manufacturing semiconductor devices and corresponding product | — | 2019-11-05 |
| 10455692 | Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof | — | 2019-10-22 |
| 10424525 | Method of manufacturing semiconductor devices | — | 2019-09-24 |
| 10294096 | Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a mems microphone and packaged device obtained thereby | — | 2019-05-21 |