Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10211093 | Interconnect structure formed with a high aspect ratio single damascene copper line on a non-damascene via | Ki-Don Lee, Steven E. English | 2019-02-19 |
DS
Daniel Sawyer
Overall (2019): #492,060 of 560,194Top 90%
1
Patents 2019