Issued Patents 2019
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446526 | Face-to-face semiconductor assembly having semiconductor device in dielectric recess | Charles W. C. Lin | 2019-10-15 |
| 10420204 | Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same | Charles W. C. Lin | 2019-09-17 |
| 10361151 | Wiring board having isolator and bridging element and method of making wiring board | Charles W. C. Lin | 2019-07-23 |
| 10354984 | Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same | Charles W. C. Lin | 2019-07-16 |
| 10306777 | Wiring board with dual stiffeners and dual routing circuitries integrated together and method of making the same | Charles W. C. Lin | 2019-05-28 |
| 10269722 | Wiring board having component integrated with leadframe and method of making the same | Charles W. C. Lin | 2019-04-23 |
| 10242964 | Wiring substrate for stackable semiconductor assembly and stackable semiconductor assembly using the same | Charles W. C. Lin | 2019-03-26 |
| 10217710 | Wiring board with embedded component and integrated stiffener, method of making the same and face-to-face semiconductor assembly using the same | Charles W. C. Lin | 2019-02-26 |
| 10211067 | Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly | Charles W. C. Lin | 2019-02-19 |
| 10199321 | Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same | Charles W. C. Lin | 2019-02-05 |
| 10177090 | Package-on-package semiconductor assembly having bottom device confined by dielectric recess | Charles W. C. Lin | 2019-01-08 |
| 10177130 | Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener | Charles W. C. Lin | 2019-01-08 |