Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483180 | Process for the wafer-scale fabrication of hermetic electronic modules | Alexandre Val | 2019-11-19 |
| 10332863 | Method of miniaturized chip on chip interconnection of a 3D electronic module | — | 2019-06-25 |