Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10186467 | Semiconductor package device and method of manufacturing the same | Bernd Karl Appelt, Kay Stefan Essig | 2019-01-22 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10186467 | Semiconductor package device and method of manufacturing the same | Bernd Karl Appelt, Kay Stefan Essig | 2019-01-22 |