Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10350634 | Method for smoothing substrate surface | William F. Leggett, Ming Kun Shi, Simon R. Lancaster-Larocque | 2019-07-16 |
| 10264685 | Multi-part electronic device housing having contiguous filled surface | Ming Kun Shi, Lindsay D. Corbet, Collin D. Chan | 2019-04-16 |