Issued Patents 2019
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497655 | Methods, circuits and systems for a package structure having wireless lateral connections | Federico Giovanni Ziglioli | 2019-12-03 |
| 10457545 | Magnetic inertial sensor energy harvesting and scavenging methods, circuits and systems | — | 2019-10-29 |
| 10453833 | Electronic system having increased coupling by using horizontal and vertical communication channels | — | 2019-10-22 |
| 10424633 | Integrated circuit comprising at least an integrated antenna | Alessandro Finocchiaro | 2019-09-24 |
| 10393692 | Integrated electronic device for monitoring humidity and/or corrosion | Bruno Murari | 2019-08-27 |
| 10364143 | Integrated micro-electromechanical device of semiconductor material having a diaphragm, such as a pressure sensor and an actuator | Alessandro Motta | 2019-07-30 |
| 10366969 | Integrated electronic device with transceiving antenna and magnetic interconnection | Giovanni Girlando | 2019-07-30 |
| 10355337 | Packaged electronic device with integrated electronic circuits having transceiving antennas | — | 2019-07-16 |
| 10330640 | Block made of a building material | — | 2019-06-25 |
| 10319708 | Electronic system having increased coupling by using horizontal and vertical communication channels | — | 2019-06-11 |
| 10288682 | Integrated electronic device having a test architecture, and test method thereof | — | 2019-05-14 |
| 10280070 | Magnetic inertial sensor energy harvesting and scavenging methods, circuits and systems | — | 2019-05-07 |
| 10267849 | Sensing structure of alignment of a probe for testing integrated circuits | — | 2019-04-23 |
| 10250301 | Network of electronic devices assembled on a flexible support and communication method | — | 2019-04-02 |
| 10250163 | Inverse electrowetting energy harvesting and scavenging methods, circuits and systems | Sara Loi | 2019-04-02 |
| 10215652 | Microelectromechanical sensing structure for a pressure sensor including a deformable test structure | — | 2019-02-26 |
| 10186463 | Method of filling probe indentations in contact pads | — | 2019-01-22 |
| 10180456 | Testing architecture of circuits integrated on a wafer | — | 2019-01-15 |