Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490505 | Single-sided power device package | — | 2019-11-26 |
| 10332825 | Semiconductor package including flip chip mounted IC and vertically integrated inductor | Parviz Parto | 2019-06-25 |
| 10242938 | Integrated shunt in circuit package | Wolfgang Furtner | 2019-03-26 |
| 10204847 | Multi-phase common contact package | — | 2019-02-12 |
| 10204873 | Breakable substrate for semiconductor die | Chuan Cheah | 2019-02-12 |
| 10206286 | Embedding into printed circuit board with drilling | Danny Clavette, Darryl Galipeau | 2019-02-12 |