Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290531 | Release layer for subsequent manufacture of flexible substrates in microelectronic applications | John Cleaon Moore, Jared Pettit | 2019-05-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290531 | Release layer for subsequent manufacture of flexible substrates in microelectronic applications | John Cleaon Moore, Jared Pettit | 2019-05-14 |