Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515891 | Radial solder ball pattern for attaching semiconductor and micromechanical chips | Eng Fook Chan, Wei-Chung Lee | 2019-12-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515891 | Radial solder ball pattern for attaching semiconductor and micromechanical chips | Eng Fook Chan, Wei-Chung Lee | 2019-12-24 |