Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297542 | Land side and die side cavities to reduce package z-height | MD Altaf Hossain | 2019-05-21 |
| 10278292 | Method for orienting solder balls on a BGA device | MD Altaf Hossain | 2019-04-30 |