Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10317428 | Probe connector for a probing pad structure around a thermal attach mounting hole | Vikas Rao, Naveen G | 2019-06-11 |
| 10199353 | Microelectronic interposer for a microelectronic package | Ranjul Balakrishnan | 2019-02-05 |
| 10177161 | Methods of forming package structures for enhanced memory capacity and structures formed thereby | Shanto A. Thomas, Ranjul Balakrishnan | 2019-01-08 |