Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418291 | Induced warpage of a thermal conductor | Jerrod Peterson | 2019-09-17 |
| 10305529 | Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices | Mark Gallina, Mark Hemmeyer, Steven J. Lofland, Ponniah Ilavarasan, Michael Edwin Stewart +1 more | 2019-05-28 |