Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10251273 | Mainboard assembly including a package overlying a die directly attached to the mainboard | Damion Searls, Weston Roth, Margaret D. Ramirez, James Jackson, Rainer Thomas | 2019-04-02 |
| 10186480 | Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same | Sriram Muthukumar | 2019-01-22 |