Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10332821 | Partially molded direct chip attach package structures for connectivity module solutions | Quan Qi, Eytan Mann, Sidharth Dalmia | 2019-06-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10332821 | Partially molded direct chip attach package structures for connectivity module solutions | Quan Qi, Eytan Mann, Sidharth Dalmia | 2019-06-25 |