Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340246 | Wire ball bonding in semiconductor devices | Han Zhong, Yong Tang, Chen Xiong, Zi Qi Wang | 2019-07-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340246 | Wire ball bonding in semiconductor devices | Han Zhong, Yong Tang, Chen Xiong, Zi Qi Wang | 2019-07-02 |