Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438870 | Semiconductor device packaging assembly, lead frame strip and unit lead frame with molding compound channels | Boon Teik Tee | 2019-10-08 |
TO
Tiam Sen Ong
Overall (2019): #242,049 of 560,194Top 45%
1
Patents 2019