Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10494556 | Magnetic and thermally conductive material and thermally conductive and dielectric layer | Chun-Pin Wu, Mean-Jue Tung, Ching-Chen Hsieh, Meng-Song Yin | 2019-12-03 |
| 10316182 | Low dielectric constant and solventless resin composition and substrate structure | Jyh-Long Jeng, Jeng-Yu Tsai | 2019-06-11 |
| 10179833 | Oligomer, composition and composite material employing the same | Ming-Tsung Hong, Yun-Ching Lee, Meng-Song Yin | 2019-01-15 |