Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490473 | Chip package module and circuit board structure comprising the same | Shin-Yi Huang, Yu-Min Lin | 2019-11-26 |
| 10490478 | Chip packaging and composite system board | Yu-Min Lin, Kuo-Shu Kao, Jing-Yao Chang | 2019-11-26 |