PE

Philip Ekkels

IV Imec Vzw: 1 patents #52 of 204Top 30%
UG Universiteit Gent: 1 patents #16 of 101Top 20%
📍 Eeklo, BE: #1 of 4 inventorsTop 25%
Overall (2019): #312,554 of 560,194Top 60%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10186447 Method for bonding thin semiconductor chips to a substrate Tom Sterken 2019-01-22