Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10332850 | Method for producing contact areas on a semiconductor substrate | Wenqi Zhang, Geraldine Jamieson, Bart Swinnen | 2019-06-25 |
| 10334755 | Liquid cooling of electronic devices | Herman Oprins, Vladimir Cherman | 2019-06-25 |
| 10271796 | Biocompatible packaging | Maria Op de Beeck, Philippe Soussan | 2019-04-30 |
| 10256183 | MIMCAP structure in a semiconductor device package | Mikael Detalle | 2019-04-09 |
| 10170450 | Method for bonding and interconnecting integrated circuit devices | Joeri De Vos, Stefaan Van Huylenbroeck | 2019-01-01 |