SC

Sungjun Chun

IBM: 3 patents #2,223 of 11,143Top 20%
🗺 Texas: #1,940 of 17,606 inventorsTop 15%
Overall (2019): #67,481 of 560,194Top 15%
3
Patents 2019

Issued Patents 2019

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
10375820 Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures Jinwoo Choi, Jason L. Frankel, Paul R. Walling, Roger D. Weekly 2019-08-06
10223490 Signal via positioning in a multi-layer circuit board using a genetic via placement solver Matteo Cocchini, Michael A. Cracraft 2019-03-05
10216884 Signal via positioning in a multi-layer circuit board using a genetic via placement solver Matteo Cocchini, Michael A. Cracraft 2019-02-26